- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
Patent holdings for IPC class H01L 23/29
Total number of patents in this class: 5331
10-year publication summary
463
|
500
|
535
|
512
|
530
|
514
|
375
|
393
|
398
|
122
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
321 |
Mitsubishi Electric Corporation | 43934 |
191 |
Rohm Co., Ltd. | 5843 |
141 |
Hitachi Chemical Company, Ltd. | 2455 |
138 |
Murata Manufacturing Co., Ltd. | 22355 |
129 |
Lintec Corporation | 1915 |
127 |
Infineon Technologies AG | 8189 |
126 |
Sumitomo Bakelite Co., Ltd. | 1416 |
119 |
Samsung Electronics Co., Ltd. | 131630 |
111 |
LG Chem, Ltd. | 17205 |
102 |
DIC Corporation | 3597 |
101 |
Nitto Denko Corporation | 7879 |
99 |
Shin-Etsu Chemical Co., Ltd. | 5132 |
97 |
Intel Corporation | 45621 |
85 |
Denso Corporation | 23338 |
79 |
Namics Corporation | 393 |
72 |
Dow Corning Toray Co., Ltd. | 562 |
68 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
65 |
Fuji Electric Co., Ltd. | 4750 |
61 |
Resonac Corporation | 2233 |
59 |
Other owners | 3040 |